Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

This paper reports on novel thermal testbeds with embedded micropin-fin heat sinks that were designed and microfabricated in silicon. Two micropin-fin arrays were presented, each with a nominal pin height of 200 lm and pin diameters of 90 lm and 30 lm. Singlephase and two-phase thermal testing of the micropin-fin array heat sinks were performed using de-ionized (DI) water as the coolant. The tested mass flow rate was 0.001 kg/s, and heat flux ranged from 30 W/cm to 470 W/cm. The maximum heat transfer coefficient reached was 60 kW/m K. The results obtained from the two testbeds were compared and analyzed, showing that density of the micropin-fins has a significant impact on thermal performance. The convective thermal resistance in the single-phase region was calculated and fitted to an empirical model. The model was then used to explore the tradeoff between the electrical and thermal performance in heat sink design. [DOI: 10.1115/1.4032496]